The High-Density Leadless Ceramic Semiconductor Packages (CQFN / CLCC) offered by InSealing provide a top-tier mounting solution engineered for surface-mount technology (SMT) with high-density integration requirements. Backed by InSealing’s expertise in advanced ceramic engineering, these packages ensure outstanding thermal dissipation, exceptional electrical characteristics, and robust durability even in the most demanding environments.
Thanks to a space-saving design and a highly optimized pad layout, our ceramic enclosures significantly minimize parasitic capacitance and inductance. This makes them the perfect choice for high-speed, high-frequency, and highly integrated microelectronics. To accommodate diverse printed circuit board (PCB) layouts, we offer versatile terminal configurations, including both two-sided and four-sided lead-out structures.
Key Features
- Ultra-compact design: Effectively minimizes parasitic effects and saves board space.
- Superior thermal management: Ensures long-lasting reliability and efficient heat dissipation.
- Versatile terminal layouts: Available in 2-sided and 4-sided pad configurations.
- Multiple pitch options: Readily available in various lead pitches (e.g., 0.50 mm, 1.00 mm, 1.27 mm, 2.54 mm).
Core Applications
- Advanced high-density SMT (Surface-Mount Technology) assemblies.
- Reliable encapsulation for Application-Specific Integrated Circuits (ASICs), Very Large Scale Integration (VLSI) systems, and Emitter Coupled Logic (ECL) components.
Product Specifications
| Product Model | Number of Leads | Lead Pitch (mm) | Cavity Size (mm) | External Dimensions (mm) | Sealing Type |
|---|---|---|---|---|---|
| CLCC04E | 4 | 1.00 | 2.80 x 1.60 | 4.00 x 3.00 | Flat Sealing |
| CLCC04J | 4 | – | 8.25 x 7.90 | 20.00 x 10.26 | Flat Sealing |
| CLCC08F | 8 | 2.54 | 7.70 x 5.40 | 9.70 x 7.40 | Flat Sealing |
| CLCC16B | 16 | 2.54 | 3.60 x 5.40 | 20.00 x 7.74 | Flat Sealing |
| CLCC16BC | 16 | 2.54 | 3.60 x 5.40 | 20.00 x 7.74 | Flat Sealing |
| CLCC20 | 20 | 1.27 | 4.60 x 4.60 | 9.00 x 9.00 | Flat Sealing |
| CLCC24 | 24 | 1.27 | 4.70 x 4.70 | 8.54 x 8.54 | Flat Sealing |
| CQFN48B | 48 | 0.50 | 4.88 x 4.88 | 7.00 x 7.00 | Gold-Tin |
| CQFN48BC | 48 | 0.50 | 4.88 x 4.88 | 7.00 x 7.00 | Gold-Tin |
Material & Performance Advantages
Manufactured from premium-grade alumina and specialized ceramic substrates, InSealing’s leadless packages boast remarkable mechanical strength, excellent thermal shock resistance, and highly stable dielectric traits. When contrasted with standard plastic encapsulations, our ceramic solutions provide virtually zero moisture ingress, outstanding hermetic sealing capabilities, and unparalleled resilience in harsh operating environments.
Furthermore, the intelligent structural design facilitates rapid heat transfer directly from the semiconductor die to the PCB, which is a critical requirement for high-frequency and high-power electronic devices.
Customization Capabilities
InSealing proudly offers tailored manufacturing to meet your specific project demands. Our flexible customization services include:
- Customized pad counts and specific pitch dimensions.
- Adjustable cavity volumes and overall package external dimensions.
- Specific hermetic sealing techniques (e.g., standard flat cover sealing or robust Gold-Tin / Au-Sn soldering).
- Bespoke surface finishing and advanced metallization patterns.
