The Hermetic Ceramic Dual In-line (DIP) Housings are premium-grade packaging solutions engineered for integrated circuits (ICs) and sensitive electronic components. Designed to deliver consistent electrical performance, superior thermal management, and robust hermetic sealing, these advanced packages meet the strictest industry standards. Forged from high-quality technical ceramics by InSealing, our housings guarantee excellent electrical isolation, exceptional mechanical strength, and long-lasting reliability even when operating under extreme environmental conditions.
Our hermetic ceramic packages are indispensable for mission-critical applications across aerospace, defense, telecommunications, medical equipment, and industrial automation sectors. When compared to traditional plastic encapsulations, InSealing’s ceramic solutions provide significantly higher heat dissipation rates, enhanced dielectric strength, and unmatched resistance to extreme temperatures, moisture, and chemical degradation. To accommodate a wide spectrum of microelectronic designs, we offer an extensive selection of lead counts, cavity dimensions, and custom sealing configurations.
Core Features
- Standard Dual In-line (DIL) pin configurations for easy integration
- Comprehensive selection of lead counts to match diverse circuit layouts
- Ultimate hermeticity for extended component lifespan
Primary Applications
- Perfectly suited for integrated circuits requiring reliable lead-out routing and moderate assembly densities
- Robust packaging for Optocouplers, MEMS (Micro-Electro-Mechanical Systems), and precision sensors
| Product Model | Number of Leads | Lead Pitch (mm) | Cavity Size (mm) | External Dimensions (mm) | Sealing Type |
|---|---|---|---|---|---|
| DIP04D | 4 | 2.54 | 5.40×3.20 | 7.40×5.20 | Flat Sealing |
| DIP06J | 6 | 2.54 | 6.60×5.40 | 8.40×7.40 | Flat Sealing |
| DIP08 | 8 | 1.27 | 5.60×4.20 | 13.20×7.40 | Flat sealing/Gold-Tin |
| DIP08CA | 8 | 2.54 | 7.70×5.40 | 9.70×7.70 | Flat Sealing |
| DIP08HA | 8 | 2.54 | 3.35×5.40 | 9.70×7.70 | Flat Sealing |
| DIP16 | 16 | 2.54 | 5.60×4.32 | 20.33×7.37 | Flat Sealing |
| DIP20 | 20 | 2.54 | 5.60×3.80 | 25.14×7.34 | Flat Sealing |
| DIP32 | 32 | 2.54 | 10.00×6.20 | 40.64×9.91 | Gold-Tin |
| DIP40 | 40 | 0.8 | 10.20×10.20 | 50.80×15.00 | Flat sealing/Gold-Tin |
Advanced Technical Specifications
Our ceramic DIP and SMD series are purpose-built to deliver unrivaled thermal dynamics and electrical precision for demanding environments. The solid ceramic infrastructure guarantees low-loss signal transmission, unshakable mechanical stability, and efficient thermal venting. This makes InSealing packages the optimal choice for both standard microelectronics and high-frequency communication devices.
Performance Advantages
- Optimized electrical conductivity paired with high current-carrying capacity
- Integrated large-area heat sink within the chip bonding area for accelerated cooling
- Dependable, long-term operational stability with superior thermal dissipation
Specialized Applications
- High-frequency Microwave and RF Device Housings
- Hermetic enclosures specifically engineered for Crystal Oscillators and frequency control components
| Product Model | Number of Leads | Cavity Size (mm) | External Dimensions (mm) | Sealing Type | Includes Heat Sink |
|---|---|---|---|---|---|
| SMD-0.1 | 2 | 2.60×2.60 | 6.00×3.50 | Flat Sealing | Yes |
| SMD-0.2 | 3 | 3.00×3.20 | 7.95×5.50 | ||
| SMD-0.3 | 2 | 4.50×4.50 | 8.00×6.00 | ||
| SMD-0.5 | 3 | 4.05×5.40 | 10.20×7.50 | ||
| SMD-1 | 3 | 8.60×8.60 | 15.90×11.38 | ||
| SMD-2 | 3 | 10.00×9.60 | 17.52×13.23 | ||
| SMD-2H | 3 | 8.10×9.80 | 17.60×13.40 |
