Direct Plated Copper

Direct plated copper refers to a process in which copper is directly deposited onto a substrate without the need for an intermediate layer, typically through electroplating or electroless plating methods. This technique is commonly used in electronic manufacturing, particularly in the production of printed circuit boards (PCBs) and semiconductor devices.
In direct plated copper processes, the substrate, often made of materials like fiberglass-reinforced epoxy resin (FR-4), polyimide, or ceramics, serves as the base onto which the copper is deposited. The direct plating of copper onto the substrate provides a conductive surface for circuitry and interconnections.
Direct plated copper is widely used in various industries where reliable and cost-effective conductive coatings are required, including electronics, telecommunications, aerospace, and automotive sectors.