Direct Bonded Copper Ceramic

Direct bonded copper ceramic refers to a type of material structure or composite commonly used in electronic packaging and thermal management applications. It's primarily employed to address the challenge of dissipating heat generated by electronic components, such as integrated circuits (ICs), power modules, and high-power LEDs.
In Direct bonded copper ceramic, copper and ceramic materials are directly bonded together to form a composite structure. This bonding is typically achieved through a process such as active metal brazing or diffusion bonding, where the copper and ceramic surfaces are brought into close contact under high temperature and pressure, allowing for atomic diffusion and formation of strong interfacial bonds.
Some common ceramics used in DBCC include aluminum oxide (Al2O3) and aluminum nitride (AlN), both of which possess high thermal conductivity and good mechanical properties suitable for electronic packaging. The choice of ceramic material depends on specific application requirements such as thermal conductivity, electrical insulation, coefficient of thermal expansion (CTE) matching with other components, and cost considerations.