Direct Bonded Copper

Direct Bonded Copper (DBC) is a technique used in electronics and electrical engineering for creating a direct thermal and electrical connection between a semiconductor device (such as a power semiconductor module) and a heat sink or other conductive substrate. In DBC, a layer of copper is bonded directly onto a ceramic substrate, typically alumina (Al2O3), through a high-temperature process. This creates a strong and durable bond between the copper layer and the ceramic substrate.
The main purpose of DBC is to provide efficient heat dissipation from the semiconductor device to the heat sink or other cooling mechanism. The copper layer offers excellent thermal conductivity, allowing heat to quickly transfer away from the semiconductor device to the surrounding environment. Additionally, DBC provides low electrical resistance, enabling efficient electrical connections between the semiconductor device and other components in the circuit.
DBC technology is commonly used in power electronics applications, such as motor drives, power converters, and inverters, where high power levels and efficient heat dissipation are critical. It offers several advantages over traditional bonding techniques, including improved thermal performance, better reliability, and enhanced electrical properties.

Ceramic-to-metal sealing


InSealing are specialized in ceramic-to-metal sealing for years. As we all know, ceramic-to-metal sealing components are widely used in the fields of new energy vehicles, electronics, semiconductor pa...