Sputtering or CVD requires absolute precision in controlling thin film deposition processes, owing to the competitive nature of the semiconductor manufacturing industry. One of the most important but often ignored pieces in the systems is Water−Cooled Power Feedthrough. This specialized feedthrough makes it possible to safely transfer very high currents (up to several kiloamperes) and high voltages into high−vacuum or plasma surroundings, while the thermal loads to be managed are performance compromising and reliability damaging.
Why Use a Water-Cooled Power Feedthrough?
High Current Capability:
With traditional electrical feedthroughs, it is a challenge to transfer hundreds or thousands of amperes needed for large-area sputtering targets or high-power CVD coils. Continuous operation without overheating is achieved by a water cooled design at extreme currents.
Thermal Management:
The aresive or RF/microwave coupling heat loss leads to rise in inddcated seal and insulation tend to girder. Insulating covers (or non conducting coolants) serve to circulate deionized water and remove heat, keeping the tempered sreset 270 Degree Celsius to 450 Degree Set A with other furnace type processes.
Vacuum Integrity and Insulation:
While conducting processes with Thin Film Deposition, Maintaining ultra-high vacuum is of utmost importance. With the water-cooled feedthroughs, ceramics like alumina remove electric weaving ensuring positive stream and electric framing seal on thermal insulation.
Key Features to Look For
When selecting a Water-Cooled Power Feedthrough for your deposition tool, consider:
Current & Voltage Ratings: Match the amperage and kilovolt requirements of your sputtering magnetron or CVD coils.
Cooling Capacity: Evaluate coolant flow rates, pressure drop, and temperature rise to ensure sufficient heat removal.
Material Compatibility: Choose materials compatible with your process gases (argon, silane, chlorine) and cleaning chemistries.
Port Configuration: Single‑pin vs. multi‑pin feedthroughs, flange types (ISO, CF, KF), and orientation should fit your chamber design.
Leak Rate: Specify UHV‑compatible leak rates (e.g., <10⁻¹⁰ mbar·L/s) to maintain process vacuum.
Applications in Sputtering and CVD
Sputtering Systems
Magnetron Sputtering: High-power magnetrons (10–50 kW) demand stable delivery of DC or pulsed currents. A robust water-Cooled feedthrough prevents overheating of the cathode power line, enabling long target life and uniform deposition across large wafers.
Reactive Sputtering: Introduction of reactive gases (O₂, N₂) can form insulating layers on electrodes. The thermal control afforded by the coolant loop reduces adhesion of insulating films on the feedthrough pin.
Chemical Vapor Deposition
Hot-Wall CVD: In horizontal or vertical hot‑wall reactors, high currents drive resistive heating coils. Water-Cooled feedthroughs enable precise temperature control, crucial for uniform film growth of materials like silicon nitride or low‑k dielectrics.
Plasma-Enhanced CVD (PECVD): RF or microwave power must pass through the chamber wall without leakage. The feedthrough’s cooling prevents dielectric breakdown and maintains plasma stability, resulting in defect-free passivation layers.
Integrating a Water-Cooled Power Feedthrough into sputtering and CVD systems is a strategic investment for any semiconductor fab aiming for high throughput, consistent film quality, and minimal downtime. By efficiently managing thermal loads and maintaining vacuum integrity, these feedthroughs play a pivotal role in modern thin film deposition.